Apple to Significantly Reduce Die Size of VCSEL Chips for Face ID Sensors [Report]
Apple is reducing the die size of vertical-cavity surface-emitting laser (VCSEL) chips used for its Face ID sensors, according to a DigiTimes report.
Apple reportedly has decided to scale down the die size by 40-50% for VCSEL chips used in 3D face ID sensors for new iPhone and iPad devices to be rolled out later in 2021, a move that will help the vendor sharply cut production cost but may reduce total wafer output for such chips, according to industry sources.
It’s likely this could help Apple fit components into a smaller notch. The redesigned notch is rumored to arrive with the iPhone 13 and could see the earpiece moved above the notch into the top bezel.
You can check out a mockup of the purported iPhone 13 design here.
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